Techsil is stocking SilCool TIA241GF silicone thermally conductive gap filler from Momentive, intended for applications where good heat transfer, low stress and good interface wetting are required.
A common problem with water baths and ice buckets in the lab is contamination of the samples from the bath water/ice. tecaLAB™ aluminum Thermal Lab Beads™ help reduce the risk of losing samples due to ...
If you run a computer without thermal compound on the processor, you could soon be in the market for a new processor. Thermal compound, also known as thermal paste and thermal grease, is a material ...
Techsil is stocking SilCool TIA241GF silicone thermally conductive gap filler from Momentive, intended for applications where good heat transfer, low stress and good interface wetting are required.
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