Dynamic modelling and control of robotic systems constitute a vital area of research, where the formulation of precise mathematical models of robot dynamics underpins the design of effective control ...
Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...
The proposed intelligent analysis method bridges high-fidelity modeling and computational efficiency. It uses an iterative algorithm to identify optimal mode shapes ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback